Invention Application
- Patent Title: COMPOSITE MAGNETIC SEALING MATERIAL AND ELECTRONIC CIRCUIT PACKAGE USING THE SAME
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Application No.: US15478419Application Date: 2017-04-04
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Publication No.: US20180138131A1Publication Date: 2018-05-17
- Inventor: Kenichi KAWABATA
- Applicant: TDK Corporation
- Applicant Address: JP TOKYO
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP TOKYO
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/29 ; H01L25/16 ; H01L25/00 ; H01L21/56 ; H01F1/147

Abstract:
Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less. The filler includes a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution, and a second magnetic filler having a second grain size distribution different from the first grain size distribution.
Public/Granted literature
- US09972579B1 Composite magnetic sealing material and electronic circuit package using the same Public/Granted day:2018-05-15
Information query
IPC分类: