发明申请
- 专利标题: THERMAL SIMULATION SYSTEM
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申请号: US15832699申请日: 2017-12-05
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公开(公告)号: US20180156552A1公开(公告)日: 2018-06-07
- 发明人: Chang-Yu Tu , Te-Ming Kung , Wen-Shyan Lai , Tung-Hua Wu
- 申请人: Chang-Yu Tu , Te-Ming Kung , Wen-Shyan Lai , Tung-Hua Wu
- 申请人地址: TW Taipei City
- 专利权人: COMPAL ELECTRONICS, INC.
- 当前专利权人: COMPAL ELECTRONICS, INC.
- 当前专利权人地址: TW Taipei City
- 主分类号: F28F27/00
- IPC分类号: F28F27/00 ; G01K17/20
摘要:
A thermal simulation system adapted to establish a test environment for a thermal test is provided. The thermal simulation system includes a communication element, a controllable loading element, a plurality of connectors, and a controller. The communication element is configured to receive at least one of a heating control signal, a fan control signal, and a loading control signal from an external electronic device. The controllable loading element is configured to provide a loading. The connectors are configured to connect a heating element and a fan. The controller is configured to control a heat energy generated by the heating element according to the heating control signal, control a fan speed of the fan according to the fan control signal, and control a loading value of the loading provided by the controllable loading element according to the loading control signal.
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