Invention Application
- Patent Title: Electronic Module
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Application No.: US15836860Application Date: 2017-12-09
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Publication No.: US20180168045A1Publication Date: 2018-06-14
- Inventor: BAU-RU LU , CHUN HSIEN LU , DA-JUNG CHEN
- Applicant: CYNTEC CO., LTD.
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/14 ; H05K1/11

Abstract:
An electronic module is disclosed, wherein the electronic module comprises: a module board and a connection board, wherein a plurality of first electronic devices are disposed over a top surface of the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to a plurality of second contact points on a top surface of the connection board, wherein a plurality of third contact points are on a bottom surface of the connection board for connecting with an external circuit.
Information query