A device case includes a resin case body having an opening which is disposed on a viewing face of the case body and a step which is disposed on an interior of the opening and protruding further to the interior than an inner face of the opening. The device case further includes a windproof member having an outer diameter smaller than an inner diameter of the opening of the case body and larger than an inner diameter of the step; and an adhesive section bonding and fixing the windproof member at a position to seal the opening of the case body. The adhesive section has higher flexibility than the case body.