发明申请
- 专利标题： ELECTRONICS CHASSIS ASSEMBLY
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申请号： US15383607申请日： 2016-12-19
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公开(公告)号： US20180177072A1公开(公告)日： 2018-06-21
- 发明人: Luis Javier Pando Rodriguez , Armando Herrera Velázquez , Luis Antonio Mendoza Gómez , Jorge Alberto Martínez Vargas , Federico Taboada Reyes , Diego Hernandez Guerra , Ramon Morales Rueda , Aquiles Tiscareño Macias
- 申请人： GE AVIATION SYSTEMS, LLC
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H05K9/00 ; F28F21/02 ; F28F21/08
摘要：
A method and apparatus for heat-dissipation in an electronics chassis can include a housing having an interior and exterior, at least two walls, at least one of which is a thermally conductive wall, a heat spreader operably coupled to at least a portion of the housing to dissipate or spread heat from a heat producing component.
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