- 专利标题: GRINDING APPARATUS AND GRINDING METHOD
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申请号: US15860132申请日: 2018-01-02
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公开(公告)号: US20180193976A1公开(公告)日: 2018-07-12
- 发明人: Akira WATANABE
- 申请人: JTEKT CORPORATION
- 申请人地址: JP Osaka-shi
- 专利权人: JTEKT CORPORATION
- 当前专利权人: JTEKT CORPORATION
- 当前专利权人地址: JP Osaka-shi
- 优先权: JP2017-002055 20170110
- 主分类号: B24B41/00
- IPC分类号: B24B41/00 ; B24B41/04
摘要:
A grinding apparatus includes grinding wheel side vibrational displacement calculation devices that obtain a vibrational displacement of a grinding wheel resulting from a vibration in an approaching/separating direction of the grinding wheel; main spindle side vibrational displacement calculation devices that obtain a vibrational displacement of a workpiece generated by propagation of the vibration in the approaching/separating direction of the grinding wheel; a relative vibrational displacement calculation unit that obtains a relative vibrational displacement between the grinding wheel and the workpiece based on the vibrational displacement of the grinding wheel and the vibrational displacement of the workpiece that have been obtained; a position change unit that creates, based on the obtained relative vibrational displacement between the grinding wheel and the workpiece, a position change command to change a position of the wheel spindle stock; and a processing controller that grinds the workpiece W based on the created position change command.
公开/授权文献
- US10543580B2 Grinding apparatus and grinding method 公开/授权日:2020-01-28
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