- 专利标题： ENCAPSULATING MATERIAL, ENCAPSULATING COVER PLATE, SINTERING EQUIPMENT, SINTERING METHOD, AND DISPLAY APPARATUS
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申请号： US15565901申请日： 2017-04-13
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公开(公告)号： US20180205035A1公开(公告)日： 2018-07-19
- 发明人: Jingjing Chen , Liang Zhang , Fuyi Cui , Lina Wang , Xuewei Li
- 申请人： BOE TECHNOLOGY GROUP CO., LTD. , Ordos Yuansheng Optoelectronics Co., Ltd.
- 优先权： CN201610320276.7 20160513
- 国际申请： PCT/CN2017/080394 WO 20170413
- 主分类号： H01L51/52
- IPC分类号： H01L51/52 ; H01L27/32 ; H01L51/56 ; C03C27/06 ; C03B19/06
摘要：
Embodiments of this disclosure provide an encapsulating material, an encapsulating cover plate, a sintering equipment, a sintering method, and a display apparatus, and relate to the technical field of display. This encapsulating material comprises a leveling auxiliary material, wherein the leveling auxiliary material is used to move upon excitation so as to level the encapsulating material when the encapsulating material is subjected to sintering, and is thus used in the encapsulation of a cover plate to be encapsulated and an encapsulating cover plate.
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