Invention Application
- Patent Title: DEVICE AND METHOD FOR SCAR SUBCISION
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Application No.: US15745955Application Date: 2016-08-10
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Publication No.: US20180214169A1Publication Date: 2018-08-02
- Inventor: Luke G. Gutwein , Rajiv Sood , Barry Davignon
- Applicant: Indiana University Research and Technology Corporation , Rose-Hulman Institute of Technology, Inc.
- Applicant Address: US IN Indianapolis US IN Terre Haute
- Assignee: Indiana University Research and Technology Corporation,Rose-Hulman Institute of Technology, Inc.
- Current Assignee: Indiana University Research and Technology Corporation,Rose-Hulman Institute of Technology, Inc.
- Current Assignee Address: US IN Indianapolis US IN Terre Haute
- International Application: PCT/US16/46345 WO 20160810
- Main IPC: A61B17/3201
- IPC: A61B17/3201

Abstract:
A scar subcision devices comprising a first elongated element comprising a pivotal connection to a second elongated element, the first elongated element having a blunt distal end, the second elongated element having a proximal-facing cutting edge at a distal end thereof, the device having a first state wherein the cutting edge is retracted to a location within an outer perimeter of the first elongated element, and a second state wherein the cutting edge is exposed outside of the outer perimeter of the first elongated element and the device transitioning between the first state and the second state by the first elongated element and the second elongated element rotating relative to each other about the pivotal connection are disclosed. Methods are also disclosed.
Public/Granted literature
- US11291466B2 Device and method for scar subcision Public/Granted day:2022-04-05
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