- 专利标题: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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申请号: US15819086申请日: 2017-11-21
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公开(公告)号: US20180218919A1公开(公告)日: 2018-08-02
- 发明人: Toshinari SASAKI , Junichiro SAKATA , Hiroki OHARA , Shunpei YAMAZAKI
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 优先权: JP2009-156422 20090630
- 主分类号: H01L21/477
- IPC分类号: H01L21/477 ; H01L21/02 ; H01L21/383 ; H01L29/66 ; H01L29/786
摘要:
An object is to manufacture a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, heat treatment (for dehydration or dehydrogenation) is performed to improve the purity of the oxide semiconductor film and reduce impurities including moisture or the like. After that, slow cooling is performed under an oxygen atmosphere. Besides impurities including moisture or the like exiting in the oxide semiconductor film, heat treatment causes reduction of impurities including moisture or the like exiting in a gate insulating layer and those in interfaces between the oxide semiconductor film and films which are provided over and below the oxide semiconductor and in contact therewith.
公开/授权文献
- US10090171B2 Method for manufacturing semiconductor device 公开/授权日:2018-10-02
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