发明申请
- 专利标题: HIGH POWER MODULE INTERFACES
-
申请号: US15417857申请日: 2017-01-27
-
公开(公告)号: US20180219305A1公开(公告)日: 2018-08-02
- 发明人: Jeffrey T. Wavering , Kevin D. Kilroy , Stephen E. Jackson
- 申请人: Hamilton Sundstrand Corporation
- 主分类号: H01R4/48
- IPC分类号: H01R4/48 ; H01R13/11
摘要:
A high power module interface system, can include a blade contact configured to be mounted to a circuit board and a mounting fork having a conductive body including a first fork extension and a second fork extension defining a power interface feature opening therebetween. The mounting fork can be configured to provide electrical connection between the conductive body and the blade contact when the blade contact is positioned within the power interface opening.
信息查询