Invention Application
- Patent Title: MODULAR PROCESSING FACILITY WITH DISTRIBUTED COOLING SYSTEMS
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Application No.: US15420965Application Date: 2017-01-31
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Publication No.: US20180220552A1Publication Date: 2018-08-02
- Inventor: Srinivas Arcot , Fred Haney , Gary Donovan , Todd Roth , Alan Lowrie , George Morlidge , Simon Lucchini , Sean Halvorsen
- Applicant: Fluor Technologies Corporation
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/00 ; F28C1/00 ; F28D15/02

Abstract:
A processing facility, including a first process block configured to carry out a first process. The first process block includes a plurality of first modules fluidly coupled to one another, and a first cooling system configured to circulate a first cooling fluid within the first process block. In addition, the processing facility includes a second process block configured to carry out a second process that is different from the first process. The second process block includes a plurality of second modules fluidly coupled to one another, and a second cooling system configured to circulate a second cooling fluid within the second process block.
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