发明申请
- 专利标题： BACKLIGHT MODULE, LIGHT GUIDE PANEL ASSEMBLY AND MANUFACTURING METHOD THEREFOR
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申请号： US15704144申请日： 2017-09-14
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公开(公告)号： US20180224696A1公开(公告)日： 2018-08-09
- 发明人: Haijun Shi , Ming Chen , Zhanchang Bu , Xian Yang , Xianghua Jin , Wenxin Zhang
- 申请人： BOE Technology Group Co., Ltd. , Beijing BOE Display Technology Co., Ltd.
- 优先权： CN201710064289.7 20170204
- 主分类号： G02F1/1335
- IPC分类号： G02F1/1335 ; F21V8/00
摘要：
A backlight module, a light guide panel assembly and a manufacturing method therefor are disclosed. The light guide panel assembly includes: two light guide panels; and bubble glue disposed between opposing surfaces of the two light guide panels and configured to adhere the two light guide panels together.
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IPC分类:
