Invention Application
- Patent Title: Circuit Package
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Application No.: US15745743Application Date: 2015-08-21
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Publication No.: US20180226316A1Publication Date: 2018-08-09
- Inventor: Chien-Hua Chen , Michael W. Cumbie , Stephen Farrar
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2015/046265 WO 20150821
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/552 ; H01L23/48 ; H01L23/373 ; B41J2/155
Abstract:
A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.
Public/Granted literature
- US10438864B2 Circuit packages comprising epoxy mold compounds and methods of compression molding Public/Granted day:2019-10-08
Information query
IPC分类:
