发明申请
- 专利标题： Soldering Jig Assembly
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申请号： US15432237申请日： 2017-02-14
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公开(公告)号： US20180229323A1公开(公告)日： 2018-08-16
- 发明人: John Nelson
- 申请人： John Nelson
- 主分类号： B23K3/08
- IPC分类号： B23K3/08 ; B23K101/38
摘要：
A soldering jig assembly for soldering conductors together includes a plate that may be positioned on a support surface. A pair of gripping units is provided. Each of the gripping units is coupled to the plate and each of the gripping units is selectively manipulated. Each of the gripping units engages an associated one of a pair of conductors.
公开/授权文献
- US10507541B2 Soldering jig assembly 公开/授权日：2019-12-17
信息查询
IPC分类:
