• Patent Title: MEMS MICROPHONE CHIP TRIMMING METHOD, APPARATUS, MANUFACTURING METHOD AND MICROPHONE
  • Application No.: US15772580
    Application Date: 2015-11-03
  • Publication No.: US20180242092A1
    Publication Date: 2018-08-23
  • Inventor: Quanbo ZouZhe WangYan Loke
  • Applicant: Goertek Inc.
  • International Application: PCT/CN2015/093733 WO 20151103
  • Main IPC: H04R31/00
  • IPC: H04R31/00 H04R19/04
MEMS MICROPHONE CHIP TRIMMING METHOD, APPARATUS, MANUFACTURING METHOD AND MICROPHONE
Abstract:
A MEMS microphone chip trimming method, apparatus, manufacturing method and microphone are disclosed herein. The method for trimming MEMS microphone chips comprises: detecting a pull-in voltage distribution of MEMS microphone chips on a wafer; providing a mask based on the pull-in voltage distribution; and trimming the MEMS microphone chips on the wafer by using the mask.
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