- 专利标题： ENCAPSULATED ELECTRONIC CIRCUIT
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申请号： US15888326申请日： 2018-02-05
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公开(公告)号： US20180256900A1公开(公告)日： 2018-09-13
- 发明人: Torsten Lehmann , Gregg Jørgen SUANING , Tony Mikael Nygard , Thomas GUENTHER , William Lim , Kushal Das
- 申请人： Torsten Lehmann , Gregg Jørgen SUANING , Tony Mikael Nygard , Thomas GUENTHER , William Lim , Kushal Das
- 优先权： AU2013902440 20130701
- 主分类号： A61N1/375
- IPC分类号： A61N1/375 ; A61N1/02 ; H01L23/055 ; H04R25/00
摘要：
A device, including an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure.
公开/授权文献
- US11529524B2 Encapsulated electronic circuit 公开/授权日：2022-12-20
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