- 专利标题: LAMINATED CORE TYPE HEAT SINK
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申请号: US15754523申请日: 2016-09-14
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公开(公告)号: US20180283802A1公开(公告)日: 2018-10-04
- 发明人: Takuya BUNGO , Atsushi OKUBO , Taiji SAKAI
- 申请人: T.RAD CO., LTD.
- 优先权: JP2015-184707 20150918
- 国际申请: PCT/JP2016/078131 WO 20160914
- 主分类号: F28F3/04
- IPC分类号: F28F3/04 ; F28F9/00 ; F28D1/03
摘要:
To further improve heat exchange performance in a laminated core type heat sink in which a plate is formed by arranging a plurality of slits in parallel to a metal flat plate and laminating the plate in large numbers.Thickness T2 of a second plate 4b positioned on the second in the lamination direction from an end lid 9 to which a semiconductor is attached is made greater than thickness T1 of a first plate 4a other than the second plate 4b.
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