A molded article having improved dielectric strength is disclosed. The molded article is formed by (a) providing a thermoplastic resin composition including a base polymer resin and a mold release agent; and (b) molding the thermoplastic resin composition to form the molded article. The dielectric strength of the molded article formed is higher than a comparator molded article comprising the thermoplastic resin composition in the absence of the mold release agent.