Invention Application
- Patent Title: Sense Amplifier Constructions
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Application No.: US16007022Application Date: 2018-06-13
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Publication No.: US20180294015A1Publication Date: 2018-10-11
- Inventor: Charles L. Ingalls , Scott J. Derner
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: G11C7/06
- IPC: G11C7/06

Abstract:
A sense amplifier construction comprises a first n-type transistor and a second n-type transistor above the first n-type transistor. A third p-type transistor is included and a fourth p-type transistor is above the third p-type transistor. A lower voltage activation line is electrically coupled to n-type source/drain regions that are elevationally between respective gates of the first and second n-type transistors. A higher voltage activation line is electrically coupled to p-type source/drain regions that are elevationally between respective gates of the third and fourth p-type transistors.
Public/Granted literature
- US10339985B2 Sense amplifier constructions Public/Granted day:2019-07-02
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