发明申请
- 专利标题: SEMICONDUCTOR DEVICE
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申请号: US15903570申请日: 2018-02-23
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公开(公告)号: US20180301422A1公开(公告)日: 2018-10-18
- 发明人: Kohei YAMAUCHI , Hiromichi GOHARA , Ryoichi KATO , Yoshinari IKEDA , Katsumi TANIGUCHI
- 申请人: FUJI ELECTRIC CO., LTD.
- 申请人地址: JP Kawasaki
- 专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人地址: JP Kawasaki
- 优先权: JP2017-080813 20170414
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L23/29 ; H01L23/31 ; H01L23/367 ; H01L23/46
摘要:
A semiconductor device encompasses a cooler made of ceramics, having a first main face and a second main face, being parallel and opposite to the first main face, defined by two opposite side faces perpendicular to the first and second main faces, a plurality of conductive-pattern layers delineated on the first main face, a semiconductor chip mounted on the first main face via one of the plurality of conductive-pattern layers, and a seal member configured to seal the semiconductor chip.
公开/授权文献
- US11201121B2 Semiconductor device 公开/授权日:2021-12-14