Invention Application
- Patent Title: Housing for Packaging Optical Transmitter Module and Optical Transmitter Module
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Application No.: US16020366Application Date: 2018-06-27
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Publication No.: US20180306973A1Publication Date: 2018-10-25
- Inventor: Min Sun , Wenjie Zhuang , Liping Wang
- Applicant: Huawei Technologies Co., Ltd.
- Priority: CN201511004829.X 20151228
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/42

Abstract:
A housing for packaging an optical transmitter module includes a body, a focusing structure, a first three-dimensional (3D) optical waveguide, and an optical fiber interface. The optical fiber interface is located inside the body and configured to accommodate a single-mode optical fiber. The first 3D optical waveguide is embedded in the body. The focusing structure is configured to receive a first single-mode optical signal and enable the received first single-mode optical signal to be focused for a first time at a focal point of the focusing structure. The first 3D optical waveguide is configured to receive the first single-mode optical signal, and output the first single-mode optical signal to the single-mode optical fiber. The focal point of the focusing structure coincides with an input end of the first 3D optical waveguide.
Public/Granted literature
- US10545286B2 Housing for packaging optical transmitter module and optical transmitter module Public/Granted day:2020-01-28
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