Invention Application
- Patent Title: MEMS Devices and Methods of Fabrication Thereof
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Application No.: US15959988Application Date: 2018-04-23
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Publication No.: US20180311955A1Publication Date: 2018-11-01
- Inventor: Jung-Huei Peng , Chun-Ren Cheng , Jiou-Kang Lee , Shang-Ying Tsai , Ting-Hau Wu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature.
Public/Granted literature
- US10688786B2 MEMS devices and methods of fabrication thereof Public/Granted day:2020-06-23
Information query
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