An electrically conductive material for a connection component is disclosed. The electrically conductive material includes a Cu—Sn alloy coating layer 5 in which a Cu content is 55 to 70 at % and has an average thickness of 0.1 to 3.0 μm, and a Sn coating layer 6 having an average thickness of 0.2 to 5.0 μm, which are formed in this order on a surface of a base material made of a copper or copper alloy sheet strip. When a reflected electron image of a material surface is observed with a scanning electron microscope at a magnification of 100 times, a region A and a region B having a higher brightness than the region A and in which the Cu—Sn alloy coating layer is not exposed coexist on the material surface, and an area ratio of the region A on the material surface is 2 to 65%.