Invention Application
- Patent Title: PLATED LAYER FORMING COMPOSITION, FILM HAVING PLATED-LAYER PRECURSOR LAYER, FILM HAVING PATTERNED PLATED LAYER, ELECTROCONDUCTIVE FILM, AND TOUCH PANEL
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Application No.: US16122651Application Date: 2018-09-05
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Publication No.: US20190001645A1Publication Date: 2019-01-03
- Inventor: Takeshi NARITA
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2016-048740 20160311
- Main IPC: B32B27/30
- IPC: B32B27/30 ; G02F1/1333 ; C08L33/26

Abstract:
An object of the present invention is to provide a plated layer forming composition which is capable of forming a plated layer having excellent alkali resistance and is capable of forming a metal layer on the plated layer even in the case of forming the plated layer by exposure with a low exposure amount; a film having a plated-layer precursor layer; a film having a patterned plated layer; an electroconductive film; and a touch panel. The plated layer forming composition of the present invention includes a polymer having a group capable of interacting with a plating catalyst or a precursor thereof, and a polyfunctional monomer having three or more acrylamide groups or methacrylamide groups.
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