Invention Application
- Patent Title: HIERARCHICALLY STRUCTURED DUPLEX ANODIZED ALUMINUM ALLOY
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Application No.: US16121931Application Date: 2018-09-05
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Publication No.: US20190003072A1Publication Date: 2019-01-03
- Inventor: Zhongfen (Vivian) Ding , Georgios S. Zafiris , Mark R. Jaworowski
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Main IPC: C25D11/12
- IPC: C25D11/12 ; C25D11/08 ; C25D11/10 ; C25D11/02 ; C25D11/06 ; C25D11/24
Abstract:
A method of growing a hierarchically structured anodized film to an aluminum substrate including growing a Phosphoric Acid Anodizing (PAA) film layer to an aluminum substrate and growing a multiple of Tartaric-Sulfuric Acid Anodizing (TSA) film layers under the Phosphoric Acid Anodizing (PAA) film layer.
Public/Granted literature
- US10793966B2 Hierarchically structured duplex anodized aluminum alloy Public/Granted day:2020-10-06
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