• Patent Title: Surface Mount Multilayer Coupling Capacitor and Circuit Board Containing the Same
  • Application No.: US16021242
    Application Date: 2018-06-28
  • Publication No.: US20190006104A1
    Publication Date: 2019-01-03
  • Inventor: Jeffrey Cain
  • Applicant: AVX Corporation
  • Main IPC: H01G4/30
  • IPC: H01G4/30 H05K1/18 H01G4/228
Surface Mount Multilayer Coupling Capacitor and Circuit Board Containing the Same
Abstract:
The present invention is directed to a surface mount coupling capacitor and a circuit board containing a surface mount coupling capacitor. The coupling capacitor includes a main body containing at least two sets of alternating dielectric layers and internal electrode layers. The coupling capacitor includes external terminals electrically connected to the internal electrode layers wherein the external terminals are formed on a top surface of the coupling capacitor and a bottom surface of the coupling capacitor opposing the top surface of the coupling capacitor.
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