Invention Application
- Patent Title: MULTILAYER ELECTRONIC COMPONENT
-
Application No.: US15980206Application Date: 2018-05-15
-
Publication No.: US20190007018A1Publication Date: 2019-01-03
- Inventor: Yuta ASHIDA , Noriyuki HIRABAYASHI , Shigemitsu TOMAKI
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2017-130061 20170703
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H03H1/00 ; H03H7/38

Abstract:
A multilayer electronic component includes a multilayer stack, and a band elimination filter formed using the multilayer stack. The band elimination filter includes a first input/output end, a second input/output end, a connection path connecting the first and second input/output ends, and a resonator coupled to the connection path. The connection path includes an impedance transformer. The resonator includes a first conductor line constituting a first distributed constant line. The impedance transformer includes a second conductor line constituting a second distributed constant line, and a through hole line section connected in series to the second conductor line.
Public/Granted literature
- US10658720B2 Multilayer electronic component Public/Granted day:2020-05-19
Information query