Aspects of the disclosure are directed to processing a component. A first coating is removed from a substrate of the component, the substrate including a first hole. Subsequent to removing the first coating from the substrate, a second coating is applied to the substrate, where a portion of the second coating at least partially blocks the first hole. Subsequent to applying the second coating to the substrate, the portion of the second coating is removed to generate a second hole through the second coating. The removal of the portion of the second coating creates a bore in the second coating that provides a clearance from an edge of the first hole on a surface of the substrate that interfaces to the second coating.