Invention Application
- Patent Title: CUTTING MODULES
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Application No.: US16073385Application Date: 2016-04-26
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Publication No.: US20190061191A1Publication Date: 2019-02-28
- Inventor: Isabel Sanz Ananos , Martin Urrutia Nebreda
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2016/029380 WO 20160426
- Main IPC: B26D1/24
- IPC: B26D1/24 ; B26D1/18 ; B41J11/70

Abstract:
In an example, a cutting module may comprise a housing to engage the cutting module with a drive shaft, a cutter engaged with the housing, and a drive system engaged with the housing. The cutting module may be movable along the drive shaft laterally to a media path, the cutter may cut media along the media path, and the drive system may lock when the drive shaft rotates in a second drive direction such that the cutting module moves with the drive shaft.
Public/Granted literature
- US10792829B2 Cutting modules Public/Granted day:2020-10-06
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