• Patent Title: LIGHT EMITTING DIODE CHIP HAVING DISTRIBUTED BRAGG REFLECTOR
  • Application No.: US15767284
    Application Date: 2016-06-17
  • Publication No.: US20190067526A1
    Publication Date: 2019-02-28
  • Inventor: Ye Seul KIMSang Won WOOKyoung Wan KIM
  • Applicant: Seoul Viosys Co., Ltd.
  • Priority: KR10-2015-0148036 20151023
  • International Application: PCT/KR2016/006428 WO 20160617
  • Main IPC: H01L33/46
  • IPC: H01L33/46
LIGHT EMITTING DIODE CHIP HAVING DISTRIBUTED BRAGG REFLECTOR
Abstract:
A light emitting diode chip including a light emitting structure having an active layer, and a distributed Bragg reflector (DBR) disposed to reflect light emitted therefrom. The DBR has first and second regions, and a third region therebetween. The first region is closer to the light emitting structure than the second and third regions. The DBR includes first material layers having a high index of refraction and second material layers having a low index of refraction alternately disposed one over another. The first material layers include first, second, and third groups having an optical thickness greater than 0.25λ+10%, in a range of 0.25λ−10% to 0.25λ+10%, and less than 0.25λ−10%, respectively. With respect to a central wavelength (λ: 554 nm) of the visible range, the first region has the first and second groups, the second region has the third group, and the third region has the second and third groups.
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