- 专利标题： IMPROVED SYSTEM USING SYSTEM IN PACKAGE COMPONENTS
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申请号： US15757042申请日： 2016-09-02
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公开(公告)号： US20190074268A1公开(公告)日： 2019-03-07
- 发明人: Masood MURTUZA , Gene Alan FRANTZ , Neeraj Kumar Reddy DANTU
- 申请人： Octavo Systems LLC
- 申请人地址： US TX Austin
- 专利权人： Octavo Systems LLC
- 当前专利权人： Octavo Systems LLC
- 当前专利权人地址： US TX Austin
- 国际申请： PCT/US16/50157 WO 20160902
- 主分类号： H01L25/10
- IPC分类号： H01L25/10 ; H01L23/538 ; H01L23/498 ; H01L23/00 ; H01L25/00 ; H01L25/16 ; H01L23/31 ; H01L23/367
摘要：
Methods, systems, and devices for enabling the use of SIP subsystems to make a configurable system with desired characteristics and features are provided. A configurable system's unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems.
公开/授权文献
- US11171126B2 Configurable substrate and systems 公开/授权日：2021-11-09
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