- 专利标题: TOUCH SENSOR ASSEMBLY AND METHOD OF MANUFACTURING SAME
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申请号: US16199992申请日: 2018-11-26
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公开(公告)号: US20190107913A1公开(公告)日: 2019-04-11
- 发明人: Hyunki KIM , Seungje PARK
- 申请人: LG ELECTRONICS INC.
- 优先权: KR10-2014-0189144 20141224
- 主分类号: G06F3/041
- IPC分类号: G06F3/041 ; F25D29/00 ; H03K17/96
摘要:
A touch sensor assembly may include a sensor mounting portion formed at a insulating substrate, and a soldering spot provided at the sensor mounting portion, wherein a touch sensor is stably fixed to the sensor mounting portion by the soldering spot. In addition, the touch sensor assembly according to an embodiment of the present disclosure includes a copper coating film coated on a insulating substrate, and a top layer printed on the copper coating film, wherein the copper coating film is protected by the top layer.
公开/授权文献
- US10564769B2 Touch sensor assembly and method of manufacturing same 公开/授权日:2020-02-18
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