There is described a method of forming a cooling hole in a component having a wall comprising a first surface and a second surface, the method comprising: directing a first laser beam onto the first surface of the component wall at an oblique angle so as to drill a first hole extending from the first surface towards the second surface; directing a second laser beam onto the second surface of the component wall at an oblique angle so as to drill a second hole extending from the second surface towards the first surface, the first and second holes intersecting to form a cooling hole passing through the component wall between the first and second surfaces.