Invention Application
- Patent Title: Method for Preparing Food
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Application No.: US15826363Application Date: 2017-11-29
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Publication No.: US20190159486A1Publication Date: 2019-05-30
- Inventor: Man Ho Cheung , Yiu Kuen Elton Ho
- Applicant: IXON Food Technology Limited
- Main IPC: A23L3/10
- IPC: A23L3/10 ; A23L3/16 ; A23L5/10

Abstract:
A method for preparing food having at least a solid food component. The method comprises, during a high-temperature, short-time stage (“HTST stage”), cooking a surface of the solid food component at a temperature (“HTST temperature”) of greater than 140° C. The method further comprises placing the food into packaging to form a sterile food package containing the food. The method also comprises, during a low-temperature, long-time stage (“LTLT stage”), cooking the sterile food package at a temperature (“LTLT temperature”) of between 40 and 100° C.
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