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发明申请
US20190160717A1 OVERMOLDED ELECTRONIC COMPONENTS FOR TRANSACTION CARDS AND METHODS OF MAKING THEREOF 审中-公开

  • 专利标题： OVERMOLDED ELECTRONIC COMPONENTS FOR TRANSACTION CARDS AND METHODS OF MAKING THEREOF
  • 申请号： US16320597
    申请日： 2017-07-26
  • 公开(公告)号： US20190160717A1
    公开(公告)日： 2019-05-30
  • 发明人: Adam Lowe
  • 申请人： CompoSecure, LLC
  • 申请人地址： US NJ Somerset
  • 专利权人： CompoSecure, LLC
  • 当前专利权人： CompoSecure, LLC
  • 当前专利权人地址： US NJ Somerset
  • 国际申请： PCT/US2017/043954 WO 20170726
  • 主分类号： B29C45/14
  • IPC分类号： B29C45/14 ;  B22D19/00 ;  B29C45/17 ;  G06K19/077
OVERMOLDED ELECTRONIC COMPONENTS FOR TRANSACTION CARDS AND METHODS OF MAKING THEREOF
摘要：
A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
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