Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US15853542Application Date: 2017-12-22
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Publication No.: US20190164967A1Publication Date: 2019-05-30
- Inventor: Jhon-Jhy LIAW
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/762 ; H01L29/66 ; H01L29/78 ; H01L29/06

Abstract:
A semiconductor device includes a first circuit and a second circuit. The first circuit includes a first gate, a first drain, and a first source. The second circuit includes a second gate, a second drain, and a second source. The first drain and the first source of the first circuit include a first doping material with a first concentration. A gate pitch and a gate critical dimension of the first gate of the first circuit are the same as a gate pitch and a gate critical dimension of the second gate of the second circuit. The second drain and the second source of the second circuit include a second doping material with a second concentration, wherein the first concentration is different from the second concentration.
Information query
IPC分类: