According to certain embodiments of the present disclosure, an electronic device and manufacturing method are disclosed. The electronic device includes: a housing including a first face, a second face, and a side member surrounding a space defined between the first face and the second face, a support member within the housing such that a side face of the support member is oriented towards an inner wall of the side member, a circuit board mounted on one face of the support member, an electrically conductive plate mounted on a second face, and a contact member mounted on the support member to electrically couple at least a portion of the side member to the circuit board, wherein the contact member includes an end portion adjacent to the plate, and an end face of the end portion includes a width smaller than a width of another portion of the contact member.