Invention Application
- Patent Title: SEMICONDUCTOR DEVICES AND METHODS OF FORMING SEMICONDUCTOR DEVICES
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Application No.: US16295562Application Date: 2019-03-07
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Publication No.: US20190206875A1Publication Date: 2019-07-04
- Inventor: Daeik Kim , Bong-Soo Kim , Jemin Park , Taejin Park , Yoosang Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2016-0055607 20160504
- Main IPC: H01L27/108
- IPC: H01L27/108
Abstract:
Semiconductor devices are provided. A semiconductor device includes a substrate. The semiconductor device includes a stack structure on the substrate. The stack structure includes a first insulating material and a second insulating material that is on the first insulating material. The semiconductor device includes a spacer that extends from a sidewall of the first insulating material of the stack structure to a portion of a sidewall of the second insulating material of the stack structure. Moreover, the semiconductor device includes a conductive line that is on the spacer. Methods of forming semiconductor devices are also provided.
Public/Granted literature
- US10998322B2 Semiconductor devices and methods of forming semiconductor devices Public/Granted day:2021-05-04
Information query
IPC分类:
