The disclosure relates to bonded assemblies (89) and a method of manufacture of such bonded assemblies (89). A such bonded assembly (89) has low residual stress and includes an inner body (91) having a substantially conical form, an outer body (90) having a substantially conical recess and a bonding region; whereby the conical form is in a first material having a thermal expansion coefficient al and the conical recess is in a second material having a thermal expansion coefficient a2 whereby al is not equal to a2; whereby said conical form includes an axis (31) extending in an axial direction and is substantially concentric with said conical recess; said bonding region including at least a third material having a plurality of grains and with an alignment of said grains relative to the generatrices of said conical form and said conical recess; said related method including an axial displacement of said inner body (91) relative to said outer body (90) simultaneous with cooling of said bonded assembly (89) from an elevated temperature to a low or ambient temperature.