An apparatus for selectively coating a portion of a wire bundle apparatus is provided. The apparatus includes a base member, a vertical member, a horizontal member, a clamp apparatus, and an attachment member. The horizontal member is mounted to the vertical member for translation between at least a first position and a second position. The clamp apparatus includes a lower die element mounted to the horizontal member and a lower die element mounted to the base member including a cavity. The attachment member includes wire cutouts and is mounted to the lower die element such that the wire cutouts are in substantial registration with the cavity. The wire cutouts are arranged with the cavity to separate wires of a wire apparatus disposed therein such that a coating material introduced within the cavity fully coats each of the wires when the horizontal member is in the second position.