Invention Application
- Patent Title: PHOTOSENSITIVE RESIN AND MANUFACTURING METHOD THEREOF
-
Application No.: US15887527Application Date: 2018-02-02
-
Publication No.: US20190241692A1Publication Date: 2019-08-08
- Inventor: Tina Qin , Joshua D. Wiensch
- Applicant: Pacific Light & Hologram, Inc.
- Main IPC: C08F222/20
- IPC: C08F222/20 ; G03H1/20
Abstract:
Various embodiments disclosed relate to photopolymerizable compositions that are suitable for making three-dimensional structures when exposed to laser light.
Public/Granted literature
- US10465029B2 Photosensitive resin and manufacturing method thereof Public/Granted day:2019-11-05
Information query
IPC分类:
