Invention Application
- Patent Title: RESIN COMPOSITION FOR RESIN MOLDING, AND RESIN MOLDING
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Application No.: US16392828Application Date: 2019-04-24
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Publication No.: US20190248992A1Publication Date: 2019-08-15
- Inventor: Tsuyoshi MIYAMOTO , Hiroyuki MORIYA , Masayuki OKOSHI
- Applicant: FUJI XEROX CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJI XEROX CO., LTD.
- Current Assignee: FUJI XEROX CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2017-058683 20170324
- Main IPC: C08L23/12
- IPC: C08L23/12 ; C08J5/04 ; C08L23/06 ; C08L23/08

Abstract:
A resin molding including a polyolefin, a polyamide in a content of 1 part by mass to 50 parts by mass per 100 parts of the polyolefin, carbon fibers in a content of 1 part by mass to 50 parts by mass per 100 parts by mass of the polyolefin, organic fibers in a content of 1 part by mass to 20 parts by mass per 100 parts by mass of the polyolefin, and a carboxylic anhydride-modified polyolefin as a compatibilizer in a content of 1 part by mass to 10 parts by mass per 100 parts by mass of the polyolefin, where a proportion of a carbon fiber and an organic fiber each having a fiber length in a range of 1 mm to 20 mm to all the carbon fibers and the organic fibers is 1% to 20% by number.
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