Invention Application
- Patent Title: ELECTRONIC COMPONENT
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Application No.: US16041314Application Date: 2018-07-20
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Publication No.: US20190252113A1Publication Date: 2019-08-15
- Inventor: Jin Ho KU , Kwi Jong LEE , Yoon Soo LEE , Won Joong KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2018-0016406 20180209
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F17/00 ; H01F41/04

Abstract:
An electronic component includes a magnetic body including a resin and first magnetic powder and having a recess on a lower surface of the magnetic body, an internal coil portion embedded in the magnetic body, and external electrodes disposed on opposing ends of the magnetic body in a length direction of the magnetic body and connected to ends of the internal coil portion, wherein the first magnetic powder disposed on a surface of the recess may have a cut surface.
Public/Granted literature
- US11211193B2 Electronic component Public/Granted day:2021-12-28
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