A method for connecting a cable with an electronic device is provided. The cable has multiple conductors of a first thickness, and the electronic device has multiple metal pads of a second thickness. The method includes removing a sheathing over the multiple conductors of the cable to expose the plurality of conductors. The method includes placing the exposed multiple conductors of the cable over the multiple metal pads of the electronic device. The method further includes focusing a laser beam over a portion of the multiple conductors, such that the laser beam welds each conductor to a corresponding metal pad.