A method for nondestructive inspection by ultrasound of a bonded assembly is provided. The method comprises two steps, consisting of measuring a thickness of an adhesive joint of the bonded assembly by an ultrasound transducer arranged on the bonded assembly in a determined position, and measuring the degree of adhesion of parts of the bonded assembly by the same ultrasound transducer maintained in the determined position, the degree of adhesion being measured by ZGV Lamb waves.