发明申请
- 专利标题: OPTICAL SEMICONDUCTOR MODULE
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申请号: US16118689申请日: 2018-08-31
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公开(公告)号: US20190285814A1公开(公告)日: 2019-09-19
- 发明人: Hideto FURUYAMA , Yoichiro KURITA , Hiroshi UEMURA
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 优先权: JP2018-050855 20180319
- 主分类号: G02B6/42
- IPC分类号: G02B6/42
摘要:
According to one embodiment, the silicon substrate includes a thinned portion and a side wall provided around the thinned portion. The thinned portion is thinned selectively from one surface. The optical element is formed on a surface of the thinned portion. The surface of the thinned portion is opposite to the one surface of the silicon substrate. The light guide member includes a lens portion, a light guide portion, and an alignment portion. The light guide portion is provided between the lens portion and the optical element. The alignment portion is for an optical connector. The thinned portion of the silicon substrate is provided between the light guide portion of the light guide member and the optical element.
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