A thermocouple assembly for use in a high-temperature gas path that includes a thermocouple. The thermocouple includes a first conductor and a second conductor, the first and second conductors formed of different materials and coupled to one another by junction, a metal sheath surrounding the first and second conductors wherein the metal sheath is substantially coaxial with the both the first conductor and the second conductor. The assembly also includes: a first termination electrically coupled to the first conductor; a second termination electrically coupled to the second conductor; a first connector configured to couple to the first termination; a second connector configured to couple to the second termination; and a housing configured to cover the first and second terminations and the first and second connectors.