发明申请
- 专利标题: SEMICONDUCTOR PACKAGE
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申请号: US16448703申请日: 2019-06-21
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公开(公告)号: US20190312013A1公开(公告)日: 2019-10-10
- 发明人: Sun-kyoung SEO , Cha-jea JO , Soo-hyun HA
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2016-0060362 20160517
- 主分类号: H01L25/065
- IPC分类号: H01L25/065 ; H01L23/532 ; H01L23/31
摘要:
A semiconductor package includes: a first semiconductor chip in which a through-electrode is provided; a second semiconductor chip connected to a top surface of the first semiconductor chip; a first connection bump attached to a bottom surface of the first semiconductor chip and including a first pillar structure and a first solder layer, and a second connection hump located between the first semiconductor chip and the second semiconductor chip, configured to electrically connect the first semiconductor chip and the second semiconductor chip, and including a second pillar structure and a second solder layer.
公开/授权文献
- US10658341B2 Semiconductor package 公开/授权日:2020-05-19