A method of stably and precisely attaching substrates and an apparatus for stably and precisely attaching substrates, the method including: placing a substrate, attached with a release film, on a shuttle stage; peeling the release film from the substrate; a transferring unit lifting the substrate from the shuttle stage; a gas supplier spraying gas toward the substrate so that the substrate is convexly curved in a direction away from the gas supplier; the substrate transferred into a chamber by the transferring unit; placing the substrate on a main stage in the chamber; and attaching the substrate to an adherend.