- 专利标题: RECEIVER AND TRANSMITTER CHIPS PACKAGING STRUCTURE AND AUTOMOTIVE RADAR DETECTOR DEVICE USING SAME
-
申请号: US15959301申请日: 2018-04-23
-
公开(公告)号: US20190326232A1公开(公告)日: 2019-10-24
- 发明人: Wei-Cheng Lin , Shih-Hsiu Tseng , Chien-Jen Hsiao
- 申请人: Wei-Cheng Lin , Shih-Hsiu Tseng , Chien-Jen Hsiao
- 主分类号: H01L23/66
- IPC分类号: H01L23/66 ; G01S13/93 ; H01Q23/00 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L25/16
摘要:
A receiver and transmitter chips packaging structure and an automotive radar detector device using same are disclosed. The receiver/transmitter chips packaging structure includes a redistribution layer, a chip set and a molded encapsulation layer. The chip set includes a receiver chip, a transmitter chip and a radio-frequency (RF) processing chip arranged on one side of redistribution layer. The molded encapsulation layer covers the side of the redistribution layer having the receiver, transmitter and RF processing chips arranged thereon and accordingly, enclosed the chip set therein. And, the RF processing chip is electrically connected to the receiver chip and the transmitter chip via a plurality of conductive lines embedded in the redistribution layer.
信息查询
IPC分类: